| 摘要 |
PROBLEM TO BE SOLVED: To provide plating equipment which can accurately form a plating layer having a uniform film thickness. SOLUTION: The plating equipment is characterized in that a resistance imparting means 6 for imparting a resistance to a current flowing between an anode 7 and a substrate 8 to be plated serving as a cathode, which are immersed in a plating solution, is provided between the anode 7 and the substrate 8 to be plated. That is to say, since a resistance is imparted to the current flowing between the anode 7 and the substrate 8 to be plated by the resistance imparting means 6, a plating film having a uniform thickness can be applied to the substrate 8 to be plated. COPYRIGHT: (C)2009,JPO&INPIT
|
