| 摘要 |
A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS microphone is mounted on the inner surface of the cover and electrically connected to the conductive trace, and has an acoustic pressure receiving surface. When the cover is mounted on the printed circuit board, the cover and the printed circuit board construct an acoustic housing which has at least one acoustic hole passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board.
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