| 摘要 |
An injection molding apparatus includes a first mold half, a second mold half opposite to the first mold half, an eject pin, a component collector and a buffer device. The eject pin penetrates through the first mold half. The component collector is configured for receiving the molding component molded. The buffer device includes a buffer plate, a connection plate and an elastic element. The elastic element includes two elastic arms connected with each other. The two elastic arms form an angle theta in a range 0°<theta<180° in its natural state and partly inserting into the buffer plate and the connection plate respectively. The buffer device is disposed at a same side as the first mold half and the buffer plate is adjacent to the second mold half. The buffer device is configured for buffering the molding component during a knockout process.
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