| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inexpensive power semiconductor device of simple structure which can improve characteristics while enhancing heat dissipation properties as compared with a prior art, and to provide an electronic apparatus, a lead frame member and a method for manufacturing the power semiconductor device. <P>SOLUTION: The power semiconductor device 100 such as a solid state relay comprising a power element 1, and a package 6 for resin sealing the power element 1 is provided independently from lead terminals G, T1 and T2 led out of the package 6 with a heat dissipation member 11 having a heat dissipation lead terminal 11a connected contiguously to and integrally with the lead terminal T2 for the power element led out of a portion 52 for mounting the power element 1, and a heat dissipating portion 11b connected integrally with the heat dissipation lead terminal 11a. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
