| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive circuit forming substrate with an ink absorbing layer, which prevents cracks or thermal decomposition from occurring on a substrate or the ink absorbing layer when forming wiring at a temperature of≥200°C, can reduce resistance of the wiring, and has good visibility and printability. SOLUTION: The conductive circuit forming substrate is equipped with the ink absorbing layer on at least one surface of a polyimide-based substrate. The ink absorbing layer comprises: (A) metal oxide particles made of at least one of metal oxide selected from silicon, titanium, zirconium and aluminum, having a primary particle diameter of 2-200 nm, and containing 50 mass% or more of aggregate particles including two or more particles bonded; and (B) a condensate having a repeating unit of M-O obtained by hydrolytic cleavage and condensation reaction of a specific alkoxide compound as a main backbone. A coating liquid with a content of 40-95 mass% of the (A) ingredient for a total amount of the (A) and (B) ingredients is applied to at least the one surface of the polyimide-based substrate and dried. The substrate is thus provided. COPYRIGHT: (C)2009,JPO&INPIT
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