| 摘要 |
PROBLEM TO BE SOLVED: To perform temporary mounting of an electronic component on an electronic component mounting substrate, and actual mounting for mounting the electronic component fixedly on the electronic component mounting substrate easily and surely. SOLUTION: In an electronic component mounting substrate 3 having a wiring layer terminal 6 being connected with the lead terminal 2 of an electronic component, a recess 7 is formed at a portion of the wiring layer terminal 6 being connected with the lead terminal 2 over a length shorter than the overall length of the lead terminal 2, and a conductive layer 8 is formed continuously to the wiring layer terminal 6 on the inner wall of the recess 7. When the electronic component is mounted temporarily, the lead terminal 2 is bent to be fitted in the recess 7 and connected with the wiring layer terminal 6. When the electronic component is actually mounted while being fixed, the lead terminal 2 and the wiring layer terminal 6 are bonded by soldering. COPYRIGHT: (C)2009,JPO&INPIT
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