发明名称 MEASURING THE SHAPE, THICKNESS VARIATION, AND MATERIAL INHOMOGENEITY OF A WAFER
摘要 In one embodiment, an interferometer system comprises an unequal path interferometer assemble comprising; a first reference flat having a first length L 1 in a first dimension, a second reference flat having a second length L 2 in the first dimension, a cavity D 1 defined by a distance between the first reference flat and the second reference flat, and a receptacle to receive an object in the cavity such that an optical path remains open between the first reference flat and the second reference flat, and a radiation targeting assembly to direct a collimated radiation beam to the interferometer assembly, a radiation collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the collimated radiation beam, record interferograms formed by a plurality of surfaces, extract phases of each of the interferograms for each of the plurality of surfaces to produce multiple phase maps, and determine each phase map from its corresponding interferogram, using a weighted least-square algorithm.
申请公布号 US2008285053(A1) 申请公布日期 2008.11.20
申请号 US20080039185 申请日期 2008.02.28
申请人 KLA-TENCOR CORPORATION 发明人 TANG SHOUHONG
分类号 G01B11/24;G01B11/06 主分类号 G01B11/24
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