| 发明名称 |
ELECTRICALLY DISBONDABLE COMPOSITIONS AND RELATED METHODS |
| 摘要 |
Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.
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| 申请公布号 |
US2008283415(A1) |
申请公布日期 |
2008.11.20 |
| 申请号 |
US20060435622 |
申请日期 |
2006.05.17 |
| 申请人 |
EIC LABORATORIES, INC. |
发明人 |
GILBERT MICHAEL D. |
| 分类号 |
B32B7/02;C25F7/00;B32B7/10;B32B7/12;C08K3/00;C08K5/00;C08L101/12;C09D5/20;C09D5/24;C09D7/12;C09D201/00;C09J5/00;C09J9/02;C09J11/04;C09J11/06;C09J11/08;C09J201/00 |
主分类号 |
B32B7/02 |
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