发明名称 PRINTED CIRCUIT BOARD
摘要 A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.
申请公布号 US2008283286(A1) 申请公布日期 2008.11.20
申请号 US20080019661 申请日期 2008.01.25
申请人 NITTO DENKO CORPORATION 发明人 HONJO MITSURU
分类号 H05K1/11;H05K1/00 主分类号 H05K1/11
代理机构 代理人
主权项
地址