| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent metallic migrations through adhesive layers among adjacent leads in a semiconductor device sealing a device, in which a semiconductor element and a plurality of the leads are connected by wires under the state supporting a plurality of the leads by bonding tapes for fixing to a plurality of the leads by means of a molding resin. <P>SOLUTION: The semiconductor elements 20 and the leads 12 are connected by the wires 30, a plurality of the leads 12 are connected to the tapes 40 for the fixing via the adhesive layers 41 and 42 and these parts are sealed by the molding resin 50. The adhesive layers 41 and 42 are configured of the mutually separated first adhesive layers 41 and second adhesive layers 42. Ones of the adjacent leads 12 is connected to the tapes 40 for the fixing by the first adhesive layers 41, and the others are connected to the tapes 40 for the fixing by the second adhesive layers 42. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
