CIRCUIT SUBSTRATE, MOLDING SEMICONDUCTOR DEVICE, TRAY AND INSPECTION SOCKET

摘要

Vias 7 penetrating a circuit substrate 2 or a seal ring 8 are provided on a part or the entire outer periphery of a molding semiconductor device 1 or in the cut region of the circuit substrate 2 , so that adhesion between a substrate and a core 2 C in the circuit substrate 2 is improved. Therefore, it is possible to suppress the exfoliation of the circuit substrate 2, improving the yields.