| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldered joint structure and its method that can alleviate a shear force at a lower cost using a difference in linear expansion coefficient between a pair of interconnected objects, the shear force acting on their soldered joint part, and can make that part long-lived. SOLUTION: In the soldered joint structure or its method, electrodes 1a and 2a, which are prepared in plural numbers at respective facing places of a pair of connected objects 1 and 2 such as an electronic component and a substrate, are connected by using: a solder ball 3 adhering to one electrode 1a or 2a; and a solder paste 4 adhering to the other electrode 2a or 1a. The solder ball 3 and the solder paste 4 adhering to the electrodes 2a and 1a located on the outer perimeter of the pair of connected objects 1 and 2 melt and become solidified into a cylindrical column. Further, the cylindrical column is so arranged that it can be obtained by increasing and decreasing a print amount of the solder paste onto the electrode 1a or 2a. COPYRIGHT: (C)2009,JPO&INPIT
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