SEMICONDUCTOR DEVICE AND FABRICATION METHOD

摘要

A semiconductor device, in which a semiconductor element is mounted on one side of a circuit board that is made up from an insulating layer and a wiring layer, includes metal posts provided on the side of said circuit board on which said semiconductor element is mounted; and a sealing layer provided on the side of said circuit board on which said semiconductor element is mounted such that said semiconductor element is covered and such that only portions of said metal posts are exposed.