| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat resistant resin paste excellent in pattern embedding property, adhesiveness, heat resistance, flexibility, printing performance and shape retention of printed matters. SOLUTION: The heat resistant resin paste is composed of first organic solvent (A1) and second organic solvent (A2) containing a soluble heat resistant resin (B) in a mixture of organic solvents (A1) and (A2), and an insoluble heat resistant resin filler (C) in a mixture of the first organic solvent (A1) and the second organic solvent (A2) wherein the heat resistant filler (C) is dispersed in a solvent containing the first organic solvent (A1), the second organic solvent (A2) and the heat-resistant resin (B). The resin paste is characterized by a viscosity of 40-200 Pa s at 25°C, a thixotropy coefficient of 1.5-6.0 and 22-35 wt.% concentration of a nonvolatile matter. COPYRIGHT: (C)2009,JPO&INPIT
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