发明名称 BLOCK COPOLYMER AND RESIN COMPOSITION, AND MOLDED ARTICLE AND CURED PRODUCT PREPARED BY USING THEM
摘要 PROBLEM TO BE SOLVED: To provide a block copolymer and a resin composition, both giving thermosetting property to a vinyl polymer while maintaining excellent characteristics of a condensation polymer and both being excellent in adhesive properties to copper or a metal; and a molded article and a cured product, both prepared by using them. SOLUTION: The block copolymer comprises 20-80 mass% condensed polymer segments (A) having at least one kind of repeating units including amide bonds, imide bonds, or amide-imide bonds and 80-20 mass% vinyl polymer segments (B) having crosslinking functional groups. The weight average molecular weight of the condensed polymer segments (A) is 1,000-400,000 g/mol; and that of the vinyl polymer segments (B) is 1,000-200,000 g/mol. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008280499(A) 申请公布日期 2008.11.20
申请号 JP20070194881 申请日期 2007.07.26
申请人 HITACHI CHEM CO LTD 发明人 SUZUMURA KOJI;YAMASHITA YUKIHIKO
分类号 C08G81/02;C08L101/00 主分类号 C08G81/02
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