METHOD FOR INHIBITING ACICULAR WHISKER FROM FORMING ON TIN PLATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for inhibiting an acicular whisker from forming in a tin plating film on a connector or a terminal which is a small and high-density packaged electronic component plated with tin or a metal mainly containing tin and no lead. SOLUTION: This inhibiting method includes irradiating the connector or the terminal 2 plated with tin or the metal mainly containing tin and no lead with an ultrasonic wave in a solution 7 in which a reducing reaction field is formed. The method is regarded as a simple post-treatment of a plating process or a working process, which can supply the connector or the terminal component that makes no acicular whisker formed thereon similarly to a conventional plating film of a metal containing lead. COPYRIGHT: (C)2009,JPO&INPIT