发明名称 COPPER FOIL WITH AL COATING FOR COPPER CLAD LAMINATE AND COPPER CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a copper foil which is superior in the adhesiveness with an insulating resin, especially, in the adhesiveness also after a heating treatment, by forming a metal layer, without performing a rust prevention treatment, a chromate treatment, or a surface treatment with a silane coupling agent or the like, in the copper foil having a flat and smooth surface required for finer pitching. SOLUTION: The copper foil with Al coating for a copper clad laminate is characterized in that the Al coating is formed on the surface thereof. Preferably, Al concentration of the coating is 85 mass% or more and the coat thickness is 0.4 nm or more. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008279663(A) 申请公布日期 2008.11.20
申请号 JP20070126144 申请日期 2007.05.10
申请人 NIKKO KINZOKU KK 发明人 SENKAWA TOMOHIRO;MURATA MASATERU
分类号 B32B15/01;C23C14/14;C23C14/34;H05K1/09 主分类号 B32B15/01
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