发明名称 High-frequency drum-style slip-ring modules
摘要 A drum-style slip-ring module ( 100 ) is used in a contact-type communication system. The module utilizes PCB construction to construct a plurality of stacked electrically-conductive rings ( 102 ) and a plurality of dielectric layers ( 104 ) electrically isolating the conductive rings. Each of the dielectric layers includes a centrally-located aperture ( 107 ). The module also includes a cylindrical ground plane ( 108 ) positioned in the centrally-located aperture. The module is configured to provide electrical connection to each of the rings at an exterior surface of the module. Each group of feed line vias can be designed as impedance-controlled transmission lines with connections to each ring group. The construction described in this invention can create slip-ring transmission line structures with bandwidth from DC to 5 GHz or higher, allowing the slip-ring to be used to transfer multi-gigabit digital data streams.
申请公布号 US2008284584(A1) 申请公布日期 2008.11.20
申请号 US20070803483 申请日期 2007.05.15
申请人 MOOG INC. 发明人 COLEMAN DONNIE S.;GALYEAN JACK T.
分类号 H05K1/02 主分类号 H05K1/02
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