| 摘要 |
A method and apparatus for fabricating a semiconductor device are disclosed. The method attaches semiconductor chips ( 130 ) on a sheet-like insulating substrate ( 101 ) integral with two or more patterned layers of conductive lines and vias and with contact pads ( 103 ) in pad locations. A mold is provided, which has a top portion ( 210 ) with metal protrusions ( 202 ) at locations matching the pad locations. The protrusions are shaped as truncated cones of a height suitable to approach the pad metal surface in the closed mold cavity. The substrate and the chip are loaded onto the bottom mold portion ( 310 ); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions are aligned with the contact pads, approaching the pad surface. After pressuring encapsulation compound into the cavity, the mold is opened; the encapsulated device has apertures to the pad locations. Any residual compound formed on the pads is removed by laser, plasma, or chemical to expose the metal surface.
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