发明名称 Electronic unit with a substrate where an electronic circuit is fabricated
摘要 <p>In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. A t least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces. </p>
申请公布号 EP1610384(A3) 申请公布日期 2008.11.19
申请号 EP20050012797 申请日期 2005.06.14
申请人 DENSO CORPORATION 发明人 UEDA, NOBUMASA;KASUYA, HIROKAZU;NUMAZAKI, KOUJI;FUKUDA, YUTAKA;SAITOU, MITSUHIRO
分类号 H01L27/02;H01L23/34;H01L29/861 主分类号 H01L27/02
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