| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that when the flexible wiring substrate used for connecting the head apparatus and a circuit substrate of an equipment main body is taken out by a die, it cannot be taken out efficiently depending on its outside shape or necessity for using a multi-layer substrate. <P>SOLUTION: The flexible wiring substrate 5 is constituted by forming separately a head part substrate 51 provided with a circuit pattern in which various electrical parts mounted on the head apparatus 1 are placed or connected and a transmission line substrate 52 forming a transmission line coupling a circuit substrate 7 placed on the equipment main body and the head part substrate 51, and connecting the head part substrate and the transmission substrate 52 by joint. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
