LED PACKAGE FOR BACK LIGHT AND BACK LIGHT UNIT COMPRISING THE SAME

摘要

The expanded backlight source can be obtained by using a plurality of LED chips in a plurality of grooves formed in the mount substrate. The LED package(1) for the back light comprises as follows. The mount substrate(10) has a plurality of grooves on the upper side. A conductive pattern layer(20) has the first and second pattern electrodes(22,24) located in each groove. A plurality of LED chips(30) is mounted on the first pattern electrode. The first pattern electrode and the second pattern electrode are serially connected with a plurality of LED chips. The mount substrate is the laminated structure of the metal reflective layer(106) and transparent isolate layer(104).