发明名称 |
POLISHING HEAD FOR POLISHING SEMICONDUCTOR WAFERS |
摘要 |
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
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申请公布号 |
KR20080100841(A) |
申请公布日期 |
2008.11.19 |
申请号 |
KR20087024319 |
申请日期 |
2007.03.01 |
申请人 |
INOPLA INC. |
发明人 |
BERKSTRESSER DAVID E.;BERKSTRESSER JERRY J.;PARK, JIN O;JEONG, IN KWON |
分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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