发明名称 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
摘要 |
A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.
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申请公布号 |
US7453141(B2) |
申请公布日期 |
2008.11.18 |
申请号 |
US20060354361 |
申请日期 |
2006.02.15 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MIYAGAWA HIROSHI;OTAGIRI MITSUHIRO |
分类号 |
H01L23/06;H01L23/04 |
主分类号 |
H01L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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