| 摘要 |
A micromechanical thermal-conductivity sensor is provided which includes a thermally insulated diaphragm formed by a recess in a base plate exhibiting poor thermal conductivity. At least one heating element is applied on the diaphragm, at least one temperature-dependent electrical resistor is applied on the diaphragm for measuring the temperature of the diaphragm, as well as at least one further temperature-dependent electrical resistor is applied outside of the diaphragm on the base plate for measuring the ambient temperature. On one or both of its sides, the diaphragm is covered by a porous cover plate permitting gas exchange by diffusion, a cavity being left open between the diaphragm and the porous cover plate.
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