Organic aluminum precursor and method of manufacturing a metal wiring using the same

摘要

In a method of manufacturing a metal wiring, an organic aluminum precursor that includes aluminum as a central metal is applied to a substrate. The organic aluminum precursor applied to the substrate is thermally decomposed to form aluminum. The aluminum is deposited on the substrate to form an aluminum wiring having a low resistance. The organic aluminum precursor includes a chemical structure in accordance with one of the chemical formulae: wherein R₁, R₂, R₃, R₄ and R₅ are independently H or a C₁-C₅ alkyl functional group, n is an integer of 1 to 5, x is 1 or 2, and y is 0 or 1, or wherein R₁, R₂, R₃, R₄ R₅, R₆, R₇ and R₈ are independently H or a C₁-C₅ alkyl functional group, and Y is boron.