发明名称 |
Apparatus for and method of bonding nano-tip using electrochemical etching |
摘要 |
Disclosed herein are an apparatus for and a method of bonding a nano-tip using electrochemical etching, in which a good bonding stability can be provided. The nano-tip bonding apparatus comprises a glass plate having a top surface of a certain desired area. An electrolytic solution having conductivity is placed on the top surface of the glass plate by means of surface tension. Means for moving reciprocally a base material having conductivity in opposite direction is provided. A carbon nano-tube is adhered to a pointed tip of the base material by means of an adhesive. An end portion of the carbon nano-tube is to be immersed in the electrolytic solution. A power supply is provided for applying an electric power to the electrolytic solution and the base material.
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申请公布号 |
US7452432(B2) |
申请公布日期 |
2008.11.18 |
申请号 |
US20050138772 |
申请日期 |
2005.05.26 |
申请人 |
KOREAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
KIM SOO HYUN;LEE JUN SOK;CHOI JAI SEONG;KANG GYUNG SOO |
分类号 |
B32B41/00 |
主分类号 |
B32B41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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