发明名称 Optical bumps for low-loss interconnection between a device and its supported substrate and related methods
摘要 The present invention is directed to an apparatus and related methods related to an optical bump for optically coupling devices. An exemplary apparatus includes a first device, a second device, and at least one optical bump. The first device has a first surface including at least one first optically active area. The second device has a second surface including at least one second optically active area positioned in an opposed and spaced-apart relationship with respect to the at least one first optically active area. The first surface is separated from the second surface by a distance. The at least one optical bump is coupled to the first surface between the at least one first optically active area and the at least one second optically active area. The at least one optical bump has a height that is less than the distance between the first surface and the second surface. The at least one optical bump is configured to couple light between the at least one second optically active area and the at least one first optically active area.
申请公布号 US7453058(B2) 申请公布日期 2008.11.18
申请号 US20050080200 申请日期 2005.03.15
申请人 FUJITSU LIMITED 发明人 LEE MICHAEL G.;YOKOUCHI KISHIO
分类号 H01J5/02 主分类号 H01J5/02
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