发明名称 Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material
摘要 A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
申请公布号 US7452595(B2) 申请公布日期 2008.11.18
申请号 US20040850875 申请日期 2004.05.21
申请人 发明人 MORITA MITSUNOBU;KUGO TOMOYUKI;GOTO HIROSHI;INABA NORIHIKO
分类号 B32B15/04;B32B7/12;C08K5/00;C08K5/3475;C09J7/02;C09J11/06 主分类号 B32B15/04
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