发明名称 |
Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material |
摘要 |
A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
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申请公布号 |
US7452595(B2) |
申请公布日期 |
2008.11.18 |
申请号 |
US20040850875 |
申请日期 |
2004.05.21 |
申请人 |
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发明人 |
MORITA MITSUNOBU;KUGO TOMOYUKI;GOTO HIROSHI;INABA NORIHIKO |
分类号 |
B32B15/04;B32B7/12;C08K5/00;C08K5/3475;C09J7/02;C09J11/06 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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