发明名称 |
Semiconductor package with contact support layer and method to produce the package |
摘要 |
A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.
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申请公布号 |
US7452747(B2) |
申请公布日期 |
2008.11.18 |
申请号 |
US20060501913 |
申请日期 |
2006.08.10 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
CHAN KAI CHONG;LEE CHARLES WEE MING;OFNER GERALD |
分类号 |
H01L21/44;H01L21/56;H01L21/60;H01L21/68;H01L23/31;H01L23/485 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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