Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods,申请号KR20077009084-传众专利搜索

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发明名称	Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
摘要
申请公布号	KR100869044(B1)	申请公布日期	2008.11.17
申请号	KR20077009084	申请日期	2007.04.20
申请人		发明人
分类号	H01L21/304;B24B37/04;C09K13/00;H01L21/321	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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