| 摘要 |
A conductor electrode and a ribbon conductor wire provided on a glass substrate are reliably and strongly connected to each other without breaking at low cost. An In solder covered copper foil ribbon conductor wire (1) comprising a not more than 300 mum-thick copper foil or tin plated copper foil (2) covered with a not more than 100 mum-thick In solder (3) (100 to 90% In and 10 to 0% Ag) on its one side (the other side(s) being optionally covered with the solder in a much smaller thickness) is mounted on an exposed part in an Mo metal backside electrode layer (4B) provided on a glass substrate (4A). An ultrasonic soldering iron (5) is pressed against the upper surface of the copper foil ribbon conductor wire (1) to melt the In solder (3) and thus to connect the copper foil ribbon conductor wire (1) to the electrode layer (4B). Alternatively, a method may also be adopted in which, after an In solder (3) (having the same composition as described above) is previously soldered to the electrode layer (4B), a ribbon-shaped copper foil or tin plated copper foil (2) is mounted on the solder followed by connection of the copper foil (2) to the electrode layer (4B) with an ultrasonic soldering iron (5). |
