METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

The focus of exposure lens is exactly corrected by using the focus level analysis apparatus. Therefore, the deformity of the semiconductor device is prevented. Provided is the manufacturing method of the semiconductor device. A step is for arranging a wafer at the lower part of the projection lens of the exposure apparatus(100). A step is for analyzing the focus of the projection lens on the surface of wafer(120). A step is for correcting the focus of the projection lens according to the analyzed result(130). A step is for minutely arraying the wafer(150). A step is for performing the exposure process on the wafer(170). The focus analysis step uses the focus level analysis apparatus.