发明名称 |
Cavity exploration device head manufacturing method for endoscope, involves soldering micro-cable on pellets, adhering micro-cable, and molding micro-cable on pellets using resin layers that completely cover unrolled part of micro-cable |
摘要 |
<p>The method involves positioning a conducting micro-cable (59) in each of through holes associated to corresponding conducting pellets (53, 54), where the micro-cable has a part unrolled over a length greater than/equal to thickness of an integrated circuit support (51) receiving a complementary MOS image sensor. The micro-cable is soldered on the associated pellets, and the micro-cable is adhered on the associated pellets by using an adhesive. The micro-cable is molded on the pellets using resin layers, where the resin layers completely cover the unrolled part of the micro-cable. An independent claim is also included for a head of a cavity exploration device, comprising an integrated circuit support.</p> |
申请公布号 |
FR2916084(A1) |
申请公布日期 |
2008.11.14 |
申请号 |
FR20070003344 |
申请日期 |
2007.05.10 |
申请人 |
STMICROELECTRONICS SA SOCIETE ANONYME |
发明人 |
LUNEAU DOMINIQUE;VARILLON PAUL |
分类号 |
H01L21/60;A61B1/04;G02B23/24;H01L23/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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