发明名称 IRRADIATING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND DISPLAY DEVICE MANUFACTURING METHOD
摘要 The required beam diameter can be obtained without the influence caused by a difference of irradiation angle of the laser beam. Therefore, it can be prevented that the irradiation condition of the laser beam is changed before or after exchanging the semiconductor laser. In the irradiation equipment for irradiating the outgoing beam light from the semiconductor laser, setting a beam radius(W) of the passive investigated material, a rate(Delta) of difference of irradiation angle' spreading, a beam wavelength(lambda) of the semiconductor laser, the focal position is defocused to equal a desired value by the determined operation equation using w, z, and Delta with a distance(z) from a focus position of the illumination optical system between the passive investigated material and the semiconductor laser to the passive investigated material.
申请公布号 KR20080100128(A) 申请公布日期 2008.11.14
申请号 KR20080041730 申请日期 2008.05.06
申请人 SONY CORPORATION 发明人 TSUKIHARA KOICHI
分类号 H01L21/324 主分类号 H01L21/324
代理机构 代理人
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