| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module capable of preventing peeling of a bonding surface or cracks thereon due to a difference in thermal expansion among a semiconductor chip, a substrate and a heat dissipation material owing to heat from the semiconductor chip, simplifying its configuration, simplifying a manufacturing process and reducing a product cost. <P>SOLUTION: The power module 1 is provided with at least the semiconductor chip 2, an insulating material 3 for insulating a current from the semiconductor chip, the heat dissipation material 4 for dissipating heat from the semiconductor chip 2, and a buffer material 5 for buffering a heat stress due to the difference in thermal expansion between the insulating material 3 and the heat dissipating material 4. The buffer material 5 is a cladding material in which a metal plate material 5b is bonded to at least one surface of the base material 5a. In the buffer material 5, metallic fins 4 are bonded as the heat dissipating material on the surface of one metallic plate material 5c. <P>COPYRIGHT: (C)2009,JPO&INPIT |
