| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for assembling an electronic device under a state where the heat dissipation plane of an electronic component is made to be uniformly in contact with a heat dissipating plate. SOLUTION: A step for tightening the enclosure portion of each electronic component with a screw, penetrating a heat dissipating plate 4 from the other side thereof, in a state where each heat dissipation plane of a plurality of electronic components 2 and 3 is in surface contact with one side of the heat dissipation plate 4; a step for inserting each lead terminal of each electronic component which is tightened to the heat dissipating plate 4 into corresponding through-hole of a printed wiring board to penetrate the through-hole; a step for positioning the printed wiring board 1 with respect to the heat dissipating plate 4, by interposing a spacer 6 between them and tightening the printed wiring board 1 to the heat dissipating plate 4 with a screw; and a step for soldering the lead terminal of each electronic component penetrating the through-hole 101 of the printed wiring board 1 to the printed wiring board 1 are performed sequentially. COPYRIGHT: (C)2009,JPO&INPIT
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