发明名称 METHOD AND COMPOSITION FOR REMOVING RESIST, ETCHING RESIDUAL, AND METAL OXIDE FROM SUBSTRATE CONTAINING ALUMINUM AND ALUMINUM-COPPER-ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a composition and a method for removing one or more kinds among a resist, etching residual, flattening residual, and metal oxide from a substrate containing aluminum or aluminum-copper-alloy. SOLUTION: The composition is to remove one or more kinds among a resist, etching residual, flattening residual, and metal oxide from the substrate containing aluminum or aluminum-copper-alloy; and contains a component giving a fluoride of approximate 0.005 wt.% to 5 wt.%, a glycol solvent of approximate 1 wt.% to 50 wt.%, acid containing phosphorus, and water. The composition is contacted with the substrate. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277718(A) 申请公布日期 2008.11.13
申请号 JP20070147428 申请日期 2007.05.07
申请人 EKC TECHNOL INC 发明人 SUZUKI TOMOKO;HIRAGA TOSHITAKA;KATSUYA YASUO
分类号 H01L21/304;C11D7/08;C11D7/10;C11D7/16;C11D7/36;C11D7/50;G03F7/42;H01L21/027 主分类号 H01L21/304
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