发明名称 CONVEYING MECHANISM FOR WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a conveying mechanism for conveying a wiring circuit board by a conveying ring between production processes with different conveying speeds when wiring circuit boards such as BGA boards are manufactured and hard to cause the defects such as the deformation and shortage of fine wiring patterns formed on the wiring circuit board and breakage of wire. SOLUTION: This conveying mechanism for conveying the wiring circuit boards by the conveying ring between the production processes with different conveying speeds when the wiring circuit boards such as BGA boards are manufactured comprises a drivingly conveying ring 10a having the conveying ring fixed to a rotating shaft and a drive releasing conveying ring 10b from which a rotating driving from the rotating shaft is released. The fixing of the conveying ring to and the releasing thereof from the rotating shaft are set arbitrarily according to the size and type of the wiring circuit board. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008273686(A) 申请公布日期 2008.11.13
申请号 JP20070118618 申请日期 2007.04.27
申请人 TOPPAN PRINTING CO LTD 发明人 OKANO TATSUHIRO
分类号 B65G13/02;B65G39/04 主分类号 B65G13/02
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