| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a luminaire capable of suppressing a lighting defect of a semiconductor light emitting element array due to breaking of a bonding wire for forming the semiconductor light emitting element array by connecting a semiconductor light emitting element group buried in a sealing member in series. <P>SOLUTION: The luminaire has a device substrate 2, a plurality of LEDs (semiconductor light emitting elements) 5, bonding wires 6, and a transparent sealing member 10. Each of the LEDs 5 has a first element electrode 17 and a second element electrode 18. The respective LEDs 5 are disposed in an array on one surface 2e of the device substrate 2. The bonding wires 6 electrically connecting the LEDs 5 have a wire diameter of 20-30 μm. The wires 6 are connected to first element electrodes 17 and second element electrodes 18 of LEDs 5 which are adjacent in the extension direction of the array in an arc shape reaching both the element electrodes and leaving one surface 2e. The bonding height (h) of the bonding wires 6 from the LEDs 5 is 50-150 μm. The LEDs 5 and bonding wires 6 are bured in the sealing member 10. <P>COPYRIGHT: (C)2009,JPO&INPIT |
