发明名称 LASER ANNEALING METHOD AND LASER ANNEAL APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain the annealing time sufficient for recovering crystallinity of a part where ions are implanted and reducing the junction depth, without having to use many laser light sources, when forming a very shallow junction. SOLUTION: A pulse laser beam 1 is oscillated in a pulse laser oscillator 12, a surface layer part where the ions are implanted is irradiated with the pulse laser beam 1, on the condition of not melting the surface layer, and the surface layer part is heated by an auxiliary heating means 19, at least until 1 microsecond elapses from the time of starting each irradiation, at every irradiation with the pulse laser beam 1 in parallel with the irradiation with the pulse laser beam 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277599(A) 申请公布日期 2008.11.13
申请号 JP20070120554 申请日期 2007.05.01
申请人 IHI CORP 发明人 KAWAKAMI RYUSUKE;NISHIDA KENICHIRO;KAWAGUCHI NORIHITO
分类号 H01L21/265;H01L21/268 主分类号 H01L21/265
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