| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding method for highly accurately uniforming the substrate thickness without a variation, by properly setting a correction value of inertial grinding caused in spark-out performed just after a grinding feed, with every one substrate grinding process. SOLUTION: This grinding work device possesses the correction value of the inertial grinding corresponding to a maximum load current value by acquiring a correlation between an inertial grinding quantity of a grinding unit 30 generated in the spark-out and the maximum load current value of a motor 33 of the grinding unit 30. The spark-out is started when the wafer thickness measured by a thickness measuring gauge 50 reaches [the correction value (the correction value = the inertial grinding quantity) corresponding to a desired value + the maximum load current value]. The wafer thickness can be set to the desired value via the inertial grinding in the spark-out. COPYRIGHT: (C)2009,JPO&INPIT
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