SEMICONDUCTOR WAFER PROCESSING APPARATUS, REFERENCE ANGULAR POSITION DETECTING METHOD AND SEMICONDUCTOR WAFER

摘要

[PROBLEMS] To provide a semiconductor wafer processing apparatus which can correctly detect a reference angular position of a semiconductor wafer for which a reference angular position is set, and to provide a reference angular position detecting method and a semiconductor wafer for which a reference angular position is correctly set. [MEANS FOR SOLVING PROBLEMS] A semiconductor wafer (100) is formed on a part of an outer circumference edge portion (101), at a position where a crystal orientation detecting plane (102) vertical to the diameter direction is at a prescribed angle from crystal orientation. The semiconductor wafer processing apparatus sequentially photographs the outer circumference edge portions (101) of the semiconductor wafer (100) in the circumference direction, and generates length data of a first outer circumference bevel surface (101b), length data of an outer circumference end surface (101a), and length data of a second outer circumference bevel surface (101c), for indicating the outer circumference edge shape. Then the semiconductor wafer processing apparatus detects, as a reference angular position, an angular position where the length data of the first outer circumference bevel surface (101b) and the length data of the second outer circumference bevel surface (101c) are minimum and the length data of the outer circumference end surface (101a) is maximum.