HALOGEN-FREE EPOXY RESIN COMPOSITION, COVERLAY FILM, BONDING SHEET, PREPREG AND PRINTED WIRING BOARD LAMINATE

摘要

An epoxy resin composition is prepared by incorporating as essential components, (A) to (D) components of (A) bisphenol A epoxy resin being free of halogen and having an epoxy equivalent weight of 1000 or less, (B) diaminodiphenylsulfon, (C) an elastomer containing at least acrylonitrile butadiene rubber containing a carboxyl group, and (D) a hardening accelerator containing at least either an organic phosphine or a phosphonium salt, and mixing (E) to (G) components of (E) a flame retardant, (F) aluminum hydroxide, and (G) a filler containing at least talc. This composition is halogen free, ensures flame retardancy, and can satisfy adhesion, electrical insulation reliability and flexibility.