| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a conductive film pattern with uniform film thickness, and a method for manufacturing a device and a method for manufacturing a liquid drop discharge head, for which the conductive film pattern forming method is used. <P>SOLUTION: The conductive film pattern forming method comprises: a process for forming a conductive film ground pattern 21a comprising a first metallic thin film on a substrate 10 having an aperture parts 18, 25 and forming dummy conductive film ground patterns 22a, 23a comprising the first metallic thin film between a formation position of the conductive film ground pattern 21a and the aperture parts 18, 25; and a process for plating the conductive film ground pattern 21a and the dummy conductive ground patterns 22a, 23a to form second metallic thin films 21b, 22b, 23b on these patterns 21a, 22a, 23a and to form a conductive film pattern 21 comprising the conductive film ground pattern 21a and the second metallic thin film 21b and dummy conductive film patterns 22, 23 which respectively comprise the dummy conductive ground patterns 22a, 23a and the second metallic thin films 22b, 23b. <P>COPYRIGHT: (C)2009,JPO&INPIT |
