| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate, capable of mounting a component with high mounting precision even on a substrate having a large size in the conveyance direction of a component mounter. <P>SOLUTION: The manufacturing method includes a region determining step (S34) for determining a first mounting region and a second mounting region different from each other on a substrate which correspond to component mountable regions of a mounting head of the component mounter; a first substrate mark disposing step (S36) for disposing a substrate mark on the first mounting region; and a second substrate mark disposing step (S36) for disposing a substrate mark on the second mounting region. <P>COPYRIGHT: (C)2009,JPO&INPIT |
