| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus in which a single laser beam is divided into four laser beams and in which, using a single scan lens, the four laser beams are each focused. <P>SOLUTION: The laser beam machining apparatus includes: a laser oscillator emitting laser beams; a first dividing means on which the laser beams emitted from the laser oscillator are incident to be selectively divided so that the incident laser beams progress along at least one path among a pair of first paths; a second dividing means on which the laser beams that passed through any one of the first paths are incident to be selectively divided so that the incident laser beams progress along at least one path among a pair of third paths; a third dividing means on which the laser beams that passed through the other one of the first paths are incident to be selectively divided so that the incident laser beams progress along at least one path among a pair of third paths; four pairs of scanners on which the laser beams that passed through the dividing means are incident to be each deflected onto desired positions on a substrate so as to be processed; and a scan lens on which the laser beams that passed through the four pairs of scanners are incident to be collected on a spot having a predetermined diameter and irradiated onto the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
