METHOD FOR MAKING MULTILAYERED CIRCUITIZED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for making a multilayer circuitized substrate for which continuous process is used in order to form conductive layers that constitute part of sub-composites, respectively.

SOLUTION: Sub-composites 75 are aligned so that the openings of conductive layers 65 may be aligned. After that, the sub-composites 75 are jointed together, and a plurality of holes are laser-punched collectively in the direction of the thickness of a junction structure. Insulating layers 103, 105 which are used for the sub-composites 75 do not contain continuous or half-continuous fibers.

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