HEAT CONDUCTIVITY COMPUTING METHOD, HEAT CONDUCTIVITY COMPUTING DEVICE, HEAT CONDUCTIVITY COMPUTING PROGRAM, THERMAL ANALYSIS METHOD, THERMAL ANALYSIS DEVICE AND THERMAL ANALYSIS PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a heat conductivity computing method, a heat conductivity computing device and a heat conductivity computing program of high accuracy on heat transfer from a heat generating electronic component body mounted on a substrate, and to provide a thermal analysis method, a thermal analysis device and a thermal analysis program. SOLUTION: A ground pattern connecting terminal 19 and a ground pattern non-connecting terminal 21 are modeled as different ones, and equivalent heat conductivity between an electronic component body model 26 and a substrate model 24 is determined based on a connection area between the ground pattern connecting terminal 19 and the substrate 13 and a connection area between the ground pattern non-connecting terminal 21 and the substrate 13. COPYRIGHT: (C)2009,JPO&INPIT