发明名称 MATERIAL REMOVING APPARATUS AND MATERIAL REMOVING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a material removing apparatus and a material removing method capable of stably taking out a molded article without spoiling the quality of the molded article even when the molded article has a fine shape. SOLUTION: The material removing apparatus 10 takes out the molded article 100 from a mold 40 for molding, and is equipped with a guide bush 42 existing on the mold 40 for molding, a guide pin 22 arranged at a position opposing the guide bush 42, a sucking part 30 for sucking the molded article 100, and a floating mechanism 20 for aligning the central position of the mold 40 for molding and the central position of the sucking part 30. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008273006(A) 申请公布日期 2008.11.13
申请号 JP20070118294 申请日期 2007.04.27
申请人 SEIKO EPSON CORP 发明人 HASEGAWA TAKASHI
分类号 B29C33/44;B22D17/22;B29C45/42 主分类号 B29C33/44
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